PCBgogo

Over the past decade, as an engineer specializing in PCBA processes, I've encountered countless challenges, ranging from soldering defects and cold soldering to PCB warping and high-speed signal integrity issues. Behind each problem lies an experience worth documenting and sharing.

The "Radical Cure" for Soldering Defects

Soldering defects are among the most common issues in almost all PCBA projects. When I first started in this field, I believed that adjusting the temperature profile properly could solve most soldering problems. However, reality is far more complex. For example, BGA solder joint voids and insufficient solder filling in plated through holes often originate from the PCB itself. During a chance collaboration, we switched to boards produced by PCBGOGO and found that under the same reflow parameters, the void rate was significantly reduced. This led me to reassess the weight of PCB manufacturing quality in the process.

The "Silent Killer" of High-Speed Signals

As products increasingly demand high-speed transmission, signal integrity issues have become a new "nightmare." In one project, USB 3.0 was experiencing frequent packet loss. After repeated testing and suspecting EMI issues, we ultimately discovered that impedance inconsistencies caused by thickness variations in the dielectric layers within the board were to blame. When collaborating with the PCB manufacturer, PCBGOGO's engineering support team provided dielectric constant test reports and suggestions for line width and spacing control, helping us stabilize signal quality.

The Importance of Batch Stability

The worst fear during mass production is "first piece OK, mass production failure." This issue troubled me for a long time. Later, I realized that much of the instability is actually caused by inconsistent supply chain selections. For PCBs, consistency between small batch prototyping and mass production processes is key. I once compared prototype boards from several different manufacturers and found that PCBGOGO had very good control over process deviations between small and medium batches, avoiding the tragedy of "smooth trial production, but failure in mass production."

DFM Experience Sharing

Experience has taught me that 90% of process issues can be avoided during the design phase. DFM is not just about checking pads and vias; it also includes panelization methods, V-CUT directions, thermal design, and more. These aspects are often overlooked initially, but the cost of addressing them later is enormous. Later in the project, I got into the habit of sending Gerber files to the PCB manufacturer for collaborative review. PCBGOGO's CAM team often pointed out details we had overlooked, such as unreasonable solder mask coverage and incorrect power layer return paths, avoiding a lot of rework later on.

A decade of PCBA process experience has increasingly convinced me of one principle: the symptoms of a problem lie on the production floor, but the root cause is in the front-end processes. Choosing the right partners, focusing on early design, and fine-tuning process control are the keys to addressing complex manufacturing issues.