| No. | Item | Process Capability Parameter |
|---|---|---|
| 1 | Base Material | Copper Core |
| 2 | Number of Layers | 1 Layer, 2 Layers, 4 Layers |
| 3 | PCB Size | 1 Layer & 2 Layers:1200*300mm or 600*500mm Multi-layers: 600*500mm |
| 4 | Quality Grade | Standard IPC 2 |
| 5 | Thermal Conductivity (ω/m-k) | 2W, 3W,8W,12W |
| 6 | Board Thickness | 0.8-2.0mm |
| 7 | Min Tracing/Spacing | 4mil / 4mil |
| 8 | Plated Through-hole size | ≥0.2mm |
| 9 | Non-Plated Through-hole size | ≥0.8mm |
| 10 | Copper Thickness | 1oz, 2oz, 3oz, 4oz, 5oz |
| 11 | Solder Mask | Green, Red, Yellow, White, Black, Blue, Purple, Matte Green, Matte Black, None |
| 12 | Surface Finish | Immersion Gold, OSP, Hard Gold, ENEPIG, Immersion Silver, None |
| 13 | Other Options | Countersinks, Castellated Holes, Custom Stackup and so on. |
| 14 | Certification | ISO9001, UL, RoHS, REACH |
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