PCBgogo

Electronic Project Engineer's Best Partner!
As printed circuit board technologies increase and electronics continue to get smaller and smaller, you need to make sure your current circuit board supplier has the appropriate equipment needed for the specialty processes that are found in more advanced circuit board designs.
Qualified Materials
FR-4 Board
Aluminum Board
Copper Base
Rogers
HDI
Buried/
blind vias
Immersion gold(ENIG)
Hard Gold
ENEPIG
OSP
Immersion silver(Ag)
HASL
with lead/
lead free
Surface Finish
Half-cut/ Castellated Holes
Impedance control
Buried/ blind vias
Via filled with resin
Countersinks/ Counterbores
Z-axis milling
Custom Stackup
Halogen-Free
Additional Options
PCBGOGO PCB Capabilities
the Number of layers
Standard
MC PCB
HDI interconnect
Rogers
1-14
1-2
4-14
1-14
Materials
FR4
High TG
Halogen Free
High Frequency
Yes
TG - 170
Yes
Yes
Max PCB size
"1layer&2layers: 1200 × 300mm or 600 × 500mm
Multi-layers: 600 × 500mm"
PCB thickness
"1 Layer/2 Layers: 0.2~2.4mm
4 Layers: 0.4~2.4mm
6 Layers: 0.8~2.4mm
8 Layers: 1.0~2.4mm
10 Layers: 1.2~2.4mm
Note: Customized PCB thickness and Layer stack up are acceptable."
Min width
3mils
Min space
3mils
Outer max cooper
"1oz/2oz/3oz (35μm/70μm/105μm)

Note:
2oz
PCB thickness≥1.2mm,
Via size≥0.25mm,
Min Track/Spacing≥0.15mm

3oz
PCB thickness≥2.0mm,
Via size≥0.3mm,
Min Track/Spacing≥0.2mm"
Inner max copper
"1oz/1.5oz (35μm/50μm)"
Min CNC finished aperture
0.15mm
Yes
Min Laser finished aperture
0.1mm
Yes
Max aspect ratio
12 : 1
Solder mask color
Green/Red/Yellow/Blue/White/Purple/Black/
Matte black/Matte green/None
Yes
Impedance control tolerance
Yes
Min annular ring
3mil
Panelization
"V-scoring, Tab-routing,
Tab-routing with Perforation (Stamp Holes)"
Yes
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