Printed circuit board is derived from the PCB (Printed Circuit Board), or also known as PWB (Printed Wiring Board). After the 1960s, various electronic and electrical products have been manufactured using electroplated through-hole circuit boards with heat-resistant and high dimensional stability substrates, which have developed rapidly and are still the main resin substrates. As the semiconductor technology developing to high-density structure, the component density also increasing, which formed the trend of advanced PCB.
History of Printed Circuit Board
The concept of laminate circuit board design has existed since 1967, but it was not until 1990 when IBM released SLC technology that microvia technology became practical. Before that, the industry to the full through-hole board, multiple lamination board to build a high wiring density. Due to the rapid progress in materials, photosensitive, thermopolymer insulation materials have been on the market, microvia technology has become a necessary design for high-density circuit boards, and appear in most handheld electronics. In addition to plating, the connection between circuit layers can also be connected using a conductive paste structure. More well-known such as: Panasonic published ALIVH and Toshiba published B2it, these technologies will be the application of circuit boards to the high-density (High Density Interconnection - HDI) era.
Today, the development of 5G, IoT and AI advancing the technology of PCB manufacturing. Traditional single/double layers PCB has been on longer meet the technology The global PCB manufacturers are making progress in smaller, thinner, and higher performance PCBs. Advanced PCB are widely used in the cell phones, multi-function POS, and security cameras. So, what is the difference between advanced PCB and standard PCB?
What is the standard PCB?
Today, PCBs are made to be larger and smaller than this standard, but the standard probably remains the most common thickness for designs. It is more accurate to say there is a range of common or standard PCB thicknesses. These include 0.031in (0.78mm ), 0.062in (1.57mm) and 0.093in (2.36mm).
The most common standard panel sizes are 18” × 24”, 18” × 12”, 9” × 24”, and 9” × 12”. A ?” clearance around the panel border is required for handling panels, although some manufacturers will extend this required clearance out to 1” for multilayer boards.
What is the advanced board?
Advanced PCB (High Density Interconnector) is the use of micro-blind buried hole technology, a circuit board with a relatively high density of line distribution. advanced board has an inner line and the outer layer of the line, and then use the drilling, hole metallization and other processes, so that each layer of the line internal connection.
The difference between advanced board and standard PCB
Advanced board is generally more layers and higher the technical grade of the raw materials than standard PCB. At the early time, the fabrication of advanced board is basically laminated 1 time, while high-grade raw materials of advanced PCB needs 2 or more times for lamination, stacked holes, plating filling holes, laser direct punching and other advanced PCB technology. When the layers of PCB increases to eight, the cost of manufacturing will be lower than the traditional lamination technology.
The electrical performance and signal correctness of advanced PCB are higher than standard PCB. High Density Integration (advanced) technology allows for smaller end product designs while meeting higher standards of electronic performance and efficiency.
PCB, also known as printed circuit board, is an important electronic component. It is the support of electronic components, is the carrier of the electrical connection of components. The common PCB board substrate is FR-4, which is made of epoxy resin and electronic grade glass cloth pressed together.
The form below shows how PCB manufacturing service different from advanced PCB and standard PCB.
Advanced PCB |
ITEMS APPLICATION |
Standard PCB |
individual working panel |
Production |
mixed working panel |
≥1 piece |
Quantity |
5,10,15,20,25...pieces |
Shengyi,Rogers,Arlon,Isola,Omega,Nelco,3M etc. Meet IPC4101 class B/L |
Material |
KB(kingboard)/GDM(goldenmax) Meet IPC4101 class B/L |
Rohm&Haas,TAIYO,Kuangshun,Meet IPC-SM-840 class |
Ink,Soldermasks |
TAIYO,Kuangshun,Meet IPC-SM-840 class T |
Min Mechanical Hole Size 0.15mm,Laser hole 0.1mm |
Drilling |
Min Mechanical Hole Size 0.2mm |
PTH (Hole copper thickness≥20um),IPC 3(25um) |
Plating |
PTH(Hole copper thickness≥18um) |
±2mil |
Soldermask offset |
±3mil |
±0.13mm |
Dimensional deviation |
±0.2mm |
0.75% |
Warping angle |
1% |
A.O.I,Kelvin Four-terminal sensing,Microsection Inspection,Solderability Test,Impedance Test... |
Test method |
A.O.I.,Fly Probe Testing |
>140℃ |
Glass transition ℃ |
>130℃ |
Humidity indicator cards |
Package |
None |
Inspection report |
Inspection report |
None |
IPC Class 2,IPC Class 3,Automotive Standard, Customer Standard |
Standard |
IPC Class 2 |
Forbid to repair tracks(IPC 3,Automotive, Customer Standard) |
Etched line |
- |
Cleanliness requirements beyond those of IPC |
Cleanliness |
Meet IPC standards |
UL,ISO9001:2008,ISO14001:2004,ISO/TS16949:2009, RoHS etc. |
Certification |
UL,ISO9001:2015,RoHS etc. |
Final Thoughts
Electronic products moves towards high density and high precision, the same requirements are put forward for blind & buried vias PCB as well as advanced PCB. PCBgogo is an experienced advanced PCB manufacturing company who offered quick-turn PCB prototype and PCB assembly services. A trustworthy PCB company that have satisfied hundreds of engineers’ demand for years.
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