日本語
Hi
After reading and watching most of the stuff I could find on hobby reflow ovens, skillets and grills, I'm thinking about getting something like this - both for reflow assembly and for pre-heat for hot air rework. I definitely want to add a pwm relay controller, I'll just build something with an Arduino, the LCD shield I have around, and open source software.
Now the thing is, there is a lot of contradicting information about what's good for reflow. Radiant or conductive heating (people seem to agree that convection is the best, but it's outside my set budget and is harder to control with an external unit), top and bottom or just bottom heat, etc. What are the experiences here in the forum? How important is the heat-up speed? Is a more powerful heating element always better? Also, my initial thought is that a bottom-heating grill or skillet may be safer because especially for BGA or QFN, you probably want the board under the chip hot first, as opposed to the chip hot first and the pads or ground plane under it heating up through the chip itself...
- Comments(1)
A****min
Dec 19.2019, 18:02:06
You need as much power as you can get within your mains power limitation, probably 2/3 bottom and 1/3 top. Then you need a controller that manages the duty cycle of the elements. the ControLeo2 is highly recommended.
