日本語
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Interesting BGA sealing method
638
1
Aug 31.2019, 12:01:48
I talked with a PCB manufacturer. They developed an interesting sealing method using small pnp placeable hotmelt parts.
It's called PLACE-N-BOND Underfilms.
They get placed befor BGA placed to position at the corners of the package.
During reflow processing the sealing material melts and covers the outside pins.
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A****min
Sep 03.2019, 17:12:39
It sounds good, so did it seal to prevent humidity under BGA?
