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X****Liu
QFN package question
527
1
Dec 17.2019, 18:02:47
Hi everyone,
As you know, almost all QFN packages have a big pad at bottom side (you can see it at bellow) and I know this pad must be ground but I am wondering that, every qfn package has GND connection at this pin?
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A****min
Dec 19.2019, 18:01:25
The die (usually made on a P substrate technology, where the substrate is used as ground of the entire chip) is directly attached to the thermal pad.
For an N bulk (substrate) chip or a P bulk negative supply chip, thermal pad is not supposed to be grounded.
