I have been doing a lot of "conventional stuff" with QFP, LCC etc. I have always wanted to get into handling BGA's for prototyping and have now my first testboard with BGA's on it (CPU + SDRAM), this is just a board with no real use, just to check BGA mounting etc.
I have preheat equipment, hotair etc. I have always used leaded solder for prototyping as this was much easier. But, when I get my hands on the BGA stuff they already comes with balls (obviously) which are lead free! I guess I have a fear for the higher temperatures/handling of the non leaded stuff, but do I have to be afraid or is this really just "business as usual" although with a little higher temperatures ... ?
The packages are 180 and 54 pins with 0.8 mm spacing,also, do any of you solder lead free BGAs using leaded paste ? When searching it seems that some say its "ok" and some say "dont do this"...
Any real world experience from fellow engineers ?
- Comments(1)
A****min
Nov 21.2019, 09:45:28
It is recommended to not mix leaded with lead free for a lot of reasons, some technical (bad solder joints, BGA balls nightmare, flux incompatibility, etc) and some legal (might end up with RoHS violation).