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I just send a budget for a PCB that have tons of buried bias (never done it before) and are WAY more expensive than a regular PCB, and with regular I mean draw tracks to power chips and stuffs, and not getting the power from power planes.
I did it because the specifications for RF chip recommend some 4 layer PCB as best, and impedance matching for RF tracks for certification later (CC3200MOD).
There is a way to manage the buried bias and not get plucked on the process ?, o a better alternative not so expensive ?
I have no experience on this, so any tip is welcome.
Thanks.
- Comments(1)
A****min
May 29.2019, 09:11:16
Controlled impedance does nor require buried vias, nor does it require any of the goofy stackups people are suggesting in this thread...
The only reason it's not typically feasible on 2 layers is because the trace width is unusually large (30-60 mil for 50 ohm). There is no problem with EMC on a properly poured and stitched 2 layer board.
