日本語
Dressing PCB solder joint defects
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Jan 23.2014, 10:40:00
(1) with a fine brush dipped in solder flux is applied to the components.
(2) with a flat spade tip heating PCB solder joints, the solder-side components or between the pin and the pad to melt, eliminating Weld, pull tip, not wetting PCB solder joint defects that PCB solder point smooth and complete.
(3) applied to the bridge of the amount of flux, with the tip of the PCB is heated to melt solder bridging and slowly outwards or to one side of the PCB solder joints drag, so bridging the PCB solder joint apart.
(4) use heat to melt the solder tip a small amount of PCB solder joints, and add a little solder wire Φ0.5-0.8mm, to grasp the speed increase solder, solder wire touched the tip should quickly leave or solder will increase too much.
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