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Trends in North American Flexible Circuit Book-to-Bill Ratio

cData are reported for rigid PCBs and flexible circuits separately. The rigid PCB data are further segmented by company size tiers, and flex data includes trends in bare circuit versus assembly revenue sources. Trends in sales of boards to the military and medical markets are reported for both rigid and flex, as well as trends in prototype sales.
Annual Subscription: (IPC Member) $600; (Nonmember) $1200

Vertical Markets Served by Reporting PCB Companies in 2012

The annual Analysis & Forecast for the PCB Industry in North America is a comprehensive overview of the industry with data and analysis on market size, sales growth, sales by product type, product mix (high-volume vs. quick turn vs. prototype), revenue trends from value-added services, trends in materials, financial metrics, vertical end-markets, U.S. imports and exports, and forecasts for total PCB Production in the Americas and the world through 2016. 70 pages. Published in July 2013.
Annual Study: (IPC Member) $450; (Nonmember) $900

Trends In Regional Shares of Worldwide PCB Production

IPC’s annual World PCB Production Report is the authoritative source of data on PCB production value by country and by product type. The estimates are developed through a consensus process by a team of the world’s leading industry analysts. The report includes commentary on global and regional PCB industry trends, as well as historical PCB production data and regional production trends. Special sections within the report examine trends in specialty laminates and metal-clad PCBs. 46 pages. Published in August 2013.
Annual Study: (IPC Member) $250; (Nonmember) $975

Investment in Technology for Responding Companies in Asia

PCB Technology Trends is a global study of technology trends in PCB manufacturing based on findings from leading companies in every region of the world. The 2011–2012 report covers issues in current PCB technology and the industry’s expectations for developments through 2014. Topics include trends in high-density interconnect (HDI) and microvias, miniaturization, embedded technology, printed electronics, optics, laminates and substrate materials, solder mask, final finishes and manufacturing equipment. Sales growth drivers, the impact on sourcing, technical challenges and unmet technology needs are also explored. The 53-page report is also available in Mandarin Chinese. Published in May 2012.
Biennial Study
New Lower Price: (IPC Member) $450; (Nonmember) $900 Percentage of 2011