PCBgogo

Keyword: PCB surface, circuit PCB , PCB design

Double panel process is as follows:

cutting plate → drill → The outer line → solder resist →character → surface treatment → molding →Will pick up

1. cutting plate

2.drill

Through drilling connect different between layer and layer

3. The outer process

1) hole metallization

Hole in the drill hole wall surface copper cover of connectivity

2) graphic transfer

Form a line graphic cover line transfer

3) copper plating

Increase the outer lines and distributed copper thick wall, improve electrical conductivity and reliability4) etching and film

Eventually form the outer line graph

4. The resistance welding process

In order to prevent external environment and good for assembly, after completion of the outer circuit PCB build a layer on the surface of protective isolation layer

Resistance welding process equipment

5. Printing element symbol

6. Surface treatment process

To prevent external environment and conducive to assembly, after completion of the resistance welding way of PCB bare lines into a surface layer connectivity of inert isolation layer.

Hot Air Leveling

7. Forming process: the puzzle size by forming process with the PCB design size and geometry shape

V - shaped groove: according to the specifications in the PCB surface form a v-shaped slot and standard

8. Final inspection

In order to ensure the quality of the finished product delivery of PCB, for special products and provide electrical test sample performance test

Source: http://www.seekic.com