PCBgogo

1.PCB substrate , DIE pads must always be the direction of the wire bond , and leads to the direction of the connection pad has been also required , and , for each DIE, welding must be placed in a cross diagonal position disk as alignment coordinate bind , which coordinates requires network connectivity accessories , generally choose to ( must have a network , otherwise the cross will not appear ) , and in order to prevent the cross being flooded copper lead to accurate positioning, general Shop by prohibiting its copper box surrounded . DIE bound to note that there is no use of pads that do not require network connection pads removed .

2 , a special production process PCB substrate , each line must be adopted by the plating line plated brass casting techniques as well as the formation of the pads and traces , or the need to use copper all other places . Here it must be noted that even if there is no electrical connection pads that do not have a network , you must in eco mode , the external frame pad pull the copper pads , otherwise the result that no copper pad will appear . Pull frame and a plating line must identify the location of the copper corrosion other layers , where the copper layer is identified by the seventh . In general, beyond the frame by the copper in 0.15mm, while the edge copper shop about 0.2mm distance from the frame .

3 , plate frame , to determine positive and negative , the best of all devices are placed on the same side , the side with three XXX logo.

4, PCB substrate with a larger pad than the average pad , a special package for the CX0201, X identifies with the C0201 difference. Summarized as follows :

0603 Pad : 1.02mmX0.92mm pad window area : 0.9mmX0.8mm, two pads to distance of 1.5mm.

0402 Pad : 0.62mmX0.62mm pad window area : 0.5mmX0.5mm, two pads to distance of 1.0mm.

0201 Pad : 0.42mmX0.42mm pad window area : 0.3mmX0.3mm, two pads to distance of 0.55mm.

5, DIE requirements are as follows : Binding pad ( single line ) minimum size 0.2mmX0.09mm90 degrees, the minimum spacing between the pads do 2MILS, the rows of the ground and power lines are also required to do pad width 0.2 mm. According to the angle of the pad binding element to adjust the angle of pull . Substrate is not easy to do when the tie line is too long , the master DIE bound pad with inner minimum distance of 0.4mm, FLASHDIE bound pad with a minimum distance of 0.2mm. Both tie the longest line should not exceed 3mm. Spacing between two rows of pads should be separated by binding 0.27mm or more.