日本語
For double sided reflow, where the peak reflow gets to 260C for 30 seconds or so, what grade of PCB would you use so it does not delaminate or deform.
I'm currently using Vapour Phase, and it peaks at 230 so, Tg140 has been fine, but it is a slow system, and i'm considering getting IR as well.
- Comments(1)
A****min
Sep 18.2019, 17:37:17
IF the PCB is at 260C for 30 seconds, that would IMO be too long and pushing or breaking the spec of all sorts of parts. TAL (time above liquidus) should be in the range of 30-90 seconds and your peak temperature in that time should be under 260C as there may well be areas of your board you haven't profiled that get hotter than the ones you have.
IR ovens are a waste of time these days. Not only do they not really exist outside of little Chinese things like the T961 but they are subject too many process limitations which include massively uneven heating, colour sensitivity, shadowing and are not exactly the best friend of things like plastic connectors.
