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PCB heat dissipation is one of the important factors to ensure stable operation and prolong life of electronic equipment. The following are some common methods and considerations for dealing with PCB heat dissipation:Good Thermal Design: During the PCB design phase, it is key to consider a good thermal design. Arrange components and heat dissipation areas reasonably to avoid heat source concentration to reduce hot spots.Heat dissipation area planning: According to the distribution of heat sources, divide the heat dissipation area and provide sufficient space for the heat dissipation area. This helps keep the temperature down and avoids heat sources interacting with each other.Heat dissipation material selection: Select materials with high thermal conductivity, such as copper, as the base material of the heat dissipation layer or heat dissipation area to promote heat conduction and diffusion.Heat dissipation layer design: Add a special heat dissipation layer, such as heat dissipation co...

The thickness of the rigid PCB board is different from that of the flexible PCB board, and the flexible PCB board can be bent. Common thicknesses of rigid PCBs range from 0.2mm, 0.4mm, 0.6mm to 2.0mm. The common thickness of flexible PCB is 0.2mm. HDI is a high-density interconnection circuit board. HDI vias have blind holes or buried holes. The processing technology used is micro-blind buried holes and laser drilling, with high processing accuracy and low cost. The ordinary circuit board drilling is mainly mechanical drilling, and only through holes make the internal connection of each layer of circuit.As a key electronic interconnection of electronic products, PCB connects many upstream and downstream industries. Upstream industries: copper foil, copper foil substrate, glass fiber cloth, resin and other raw material industries; downstream industries: electronic consumer products, automobiles, communications, aerospace, military and other industries. Midstream base material: mainly c...

The PCB industry has developed for such a long time, and now there are some new changes in PCB design. One is more miniaturization, which is mainly driven by the portability requirements of smart devices; the other is the transformation of PCBs from traditional rigid boards to rigid-flex boards. And when the PCB is moving towards the high-end, there are two main aspects, one is that the data carrying and transmission rate are getting higher and higher, and the other is that for smart home and wearable devices, the demand for HDI is becoming more and more obvious.Users requirements for PCBs are also getting higher and higher. Experts say that higher speed, smaller size and faster time to market are both challenges and opportunities for PCB design. For customers, on the premise of meeting performance indicators, it is better to have a faster design delivery time.

The design current of the PCB board is usually a small current, so how to make the PCB board able to withstand a larger current? The electronic products used in daily life are only tens of milliamps to several amps. If there are tens of amps or more than 100A, it must not directly cause board burns or safety accidents. So what can be done to address such concerns?Method 1: Routing on the PCBThis method is the most used method in our PCB design, because the wider the trace on the PCB, the greater the current carrying capacity. But trace width is not linearly related to current carrying capacity. Assuming that under the same conditions, a 10mil trace can withstand a current of 1A, but a 50mil trace cannot withstand a current of 5ATherefore, we need to understand the structure of the PCB at this time. Taking a simple two-layer board as an example, this circuit board is usually a three-layer structure: copper skin, plate, and copper skin. Among them, the copper skin is the main path throug...

The ubiquity of PCBs in our daily lives continues to expand, and this growth is largely driven by consumer demand for smarter products that can monitor or control more common activities in which we engage, as well as industry demand . For example, in aerospace, medical devices, automotive, and commercial electronics, industry needs include enhanced functionality and capabilities. These needs have been met through the utilization and development of new materials, new components, and manufacturing techniques, and PCB manufacturing processes and equipment must continue to evolve.HDIHigh Density Interconnect (HDI) was developed to meet the demand for ever smaller and more powerful products, especially when it comes to routing. This feature reduces the number of layers in the PCB stackup and facilitates high-speed signal transmission. High-density interconnect manufacturing faces the challenge of making traces so that more traces can be routed in a smaller area, which introduces issues such...

Microstrain: It is a dimensionless physical quantity. When a PCBA is subjected to external force, a deformation will occur in the PCBA. The tensile strain becomes positive, and the compression shortens strain is negative. The general limit in the industry is 500μe. Principal strain: The maximum and minimum orthogonal strains in a plane, and the shear strain in the direction perpendicular to each other is "0".Strain rate: is used to describe the degree of how fast the strain changes. The amount of change in strain divided by the time interval over which this change was measured. The strain rate is also used to measure the risk of component rupture, and is mostly used to measure the rupture risk of BGA tin points. For MLCC, strain is mainly used to measure the rupture risk of components. If the strain rate is generally not required by customers, the limit value is generally 100000μe/s.By quantifying the strain at the position of the MLCC in the process through the strain test, it is very...

The inductive sensor is a device that uses the law of electromagnetic induction to realize non-electrical measurement through the change of the self-inductance and mutual inductance of the coil. It is characterized by the use of the physical characteristics of the inductance, which can measure displacement, vibration, pressure, flow and other signals without direct contact with the measured object.1. Classification of inductive sensorsInductive sensors are divided into three types: self-inductance, mutual inductance and eddy current according to their working principles.1. Self-inductive sensor: A self-inductive inductive sensor is a sensor that changes the self-inductance coefficient. It consists of coil, iron core and armature. Between the iron core and the armature, there is an air gap δ and an air gap magnetic permeability cross-sectional area S0, which are two parameters that are easy to change.The total reluctance of the magnetic circuit of the self-inductive sensor can be expres...

In design, layout is an important part. The quality of the layout result will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step to a successful PCB design.There are two layout methods, one is interactive layout and the other is automatic layout.Generally, it is adjusted by interactive layout on the basis of automatic layout. During layout, the gate circuit can also be redistributed according to the wiring situation, and the two gate circuits can be exchanged to make it the best layout for easy wiring.After the layout is completed, the design files and related information can also be returned and marked on the schematic diagram, so that the relevant information in the PCB board is consistent with the schematic diagram, so that the future filing and design changes can be synchronized. The information is updated to enable board-level verification of the electrical performance and functionality of the circuit.Common rules for wirin...